Samsung semiconductor company has managed to offer a better deal than TSMC and will manufacture the whole batch of Qualcomm’s Snapdragon 875 (tentative name) chipset for next year flagship phones.
The size of the contract is reportedly close to US$1 billion. Samsung Electronics has recently started volume production of the Snapdragon 875, using extreme ultraviolet (EUV) lithography equipment at its foundry line in Hwaseong, Gyeonggi Province.
Samsung next flagship Galaxy S21 and other high-end phones of Xiaomi and Oppo are said to be powered by Snapdragon 875.
